Ponente
Descripción
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) requires new high-radiation tolerant silicon pixel sensors for the innermost part of the tracking detector in the CMS experiment. The innermost layer of the tracker will be exposed to a fluence of 2.6E16 neq/cm2 during the high-luminosity operation period. The 3D pixel sensor technology has been proven to be the best option for such a layer in terms of radiation tolerance and low power consumption. An extensive program aiming at 3D pixel sensors interconnected with the CROCv1 readout chip, which is a prototype of the final version, has been carried out. The sensors have been produced by the FBK (Trento, Italy) and CNM (Barcelona, Spain) foundries. The modules have been tested on beam at CERN and DESY, before and after irradiation up to an equivalent fluence of about 1.6E16 neq/cm2. An overview of the methodology used to determine the performance of these devices, as well as the results obtained in the latest beam test experiments will be shown.
