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SUMMARY:Development of a Non-Invasive Quality Control System for Semicondu
 ctor Wafer Inspection
DTSTART;VALUE=DATE-TIME:20251119T140000Z
DTEND;VALUE=DATE-TIME:20251119T141500Z
DTSTAMP;VALUE=DATE-TIME:20260422T060003Z
UID:indico-contribution-29255@indico.ific.uv.es
DESCRIPTION:Speakers: David Galacho (IFIC (CSIC-UV))\nGroup II-VI semicond
 uctors are being explored for room-temperature X-ray imaging due to their 
 excellent properties\, especially high resistivity and wide bandgap. Howev
 er\, their performance is often limited by crystalline defects and surface
  imperfections that trap charges and increase leakage currents.\nWafer ins
 pection to ensure the quality of base materials through optical means prio
 r to hybridization could positively impact detector production yield with 
 these materials. These techniques include non-destructive examination of t
 he wafer's surface topography and internal structure to guarantee chip fun
 ctionality and reliability.\nThis work focuses on the development of a qua
 lity-control protocol to characterize semiconductor base materials\, inclu
 ding complementary techniques such as IR transmission microscopy for bulk 
 defects and Scanning Electron Microscopy (SEM) for surface morphology.\n\n
 https://indico.ific.uv.es/event/8035/contributions/29255/
LOCATION:
URL:https://indico.ific.uv.es/event/8035/contributions/29255/
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