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SUMMARY:Microchannel Cooling Developments at IMB-CNM
DTSTART;VALUE=DATE-TIME:20240509T100000Z
DTEND;VALUE=DATE-TIME:20240509T101500Z
DTSTAMP;VALUE=DATE-TIME:20260429T031959Z
UID:indico-contribution-23597@indico.ific.uv.es
DESCRIPTION:Speakers: Miguel Ullan (CNM-Barcelona)\nThe progressive shrink
 ing of dimensions and system integration in radiation detector systems for
  experimental physics introduce important challenges for the cooling of se
 nsors and electronics. The increased heat densities\, combined with the co
 mplexity of detector assemblies\, make the full integration of the sensors
 \, electronics\, and services more and more complex. In order to overcome 
 these difficulties microchannel cooling has been proposed to increase the 
 cooling efficiency\, reducing the heat transfer path to the detector volum
 e and therefore increasing the heat removal performance\, while improving 
 the integration of the cooling with the sensor and front-end electronics h
 ybrid system. We will present the technological developments carried out a
 t CNM in the field of microchannel cooling. \nIn the past we already devel
 oped a technology of embedded microchannels on silicon substrates by the u
 se of Deep Reactive Ion Etching (DRIE) and wafer bonding techniques and de
 monstrated the successful liquid flow and cooling performance. Now we work
  on adding interconnection functionality to cooling interposers with embed
 ded microchannels. The developed interposers provide mechanical support an
 d high-efficient cooling. We will present the extension of the microchanne
 l technology to incorporate a metal redistribution layer (RDL) in order to
  facilitate the interconnection of the signal and power with the backend e
 lectronics. Additionally\, we work on the full integration of the microcha
 nnels with the sensors itself. Several techniques can be applied for this 
 purpose\, and they present different advantages and challenges. We will se
 lect the optimal technology to achieve the full integration.\n\nhttps://in
 dico.ific.uv.es/event/7477/contributions/23597/
LOCATION:Colegio Mayor Rector Peset Salón de Actos 
URL:https://indico.ific.uv.es/event/7477/contributions/23597/
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